Closed

COPPER PILLAR FLIP CHIP ASSEMBLY TECHNOLOGY FOR HIGH DENSITY COMPONENTS EXPRO+

This call closed on 2026-06-05. Most European programmes run recurring cycles — track the next one in VIRA.

ReferenceAO-1-13410
Source programmeesa
Typetender
SegmentOpen Competition
Statusclosed
Closing date2026-06-05
Indicative budget> 500 KEURO
Last updated2026-04-25

What this call is about

Objective: To develop flip chip assembly capabilities for

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Frequently asked

When is the deadline for AO-1-13410?

The listed closing date is 2026-06-05. Always verify on the official programme page — deadlines can shift.

How do I check if my startup is eligible?

Eligibility depends on country, entity type, team size and technology readiness (TRL). VIRA.space (Virtual Innovation Research Assistant) runs a free structured eligibility check against the full call requirements — this page shows only a teaser summary.

Where is the official call published?

The authoritative source is the issuing programme's portal: official call page. VIRA links every tracked tender back to its origin.

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